On-Chip Inductive Interconnects Design Methodologies
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On-Chip Inductive Interconnects (2009)
DE PB NW RPISBN: 9783639157246 bzw. 3639157249, in Deutsch, VDM Verlag Jun 2009, Taschenbuch, neu, Nachdruck.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
This item is printed on demand - Print on Demand Titel. Neuware - With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced. 308 pp. Englisch.
This item is printed on demand - Print on Demand Titel. Neuware - With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced. 308 pp. Englisch.
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On-Chip Inductive Interconnects : Design Methodologies (2009)
~EN PB NW RPISBN: 9783639157246 bzw. 3639157249, vermutlich in Englisch, VDM Verlag Jun 2009, Taschenbuch, neu, Nachdruck.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
This item is printed on demand - Print on Demand Neuware - With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced. 308 pp. Englisch.
This item is printed on demand - Print on Demand Neuware - With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced. 308 pp. Englisch.
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On-Chip Inductive Interconnects
DE PB NWISBN: 9783639157246 bzw. 3639157249, in Deutsch, Vdm Verlag Dr. Müller, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
buecher.de GmbH & Co. KG, [1].
With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced.2009. 308 S. 220 mmVersandfertig in 3-5 Tagen, Softcover.
buecher.de GmbH & Co. KG, [1].
With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced.2009. 308 S. 220 mmVersandfertig in 3-5 Tagen, Softcover.
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On-Chip Inductive Interconnects - Design Methodologies
~EN PB NWISBN: 9783639157246 bzw. 3639157249, vermutlich in Englisch, VDM Verlag, Taschenbuch, neu.
On-Chip Inductive Interconnects: With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced. Englisch, Taschenbuch.
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On-Chip Inductive Interconnects (2009)
~EN PB NWISBN: 9783639157246 bzw. 3639157249, vermutlich in Englisch, VDM Verlag Jun 2009, Taschenbuch, neu.
Von Händler/Antiquariat, BuchWeltWeit Inh. Ludwig Meier e.K. [57449362], Bergisch Gladbach, Germany.
Neuware - With the decrease in feature size of CMOS integrated 308 pp. Englisch.
Neuware - With the decrease in feature size of CMOS integrated 308 pp. Englisch.
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On-Chip Inductive Interconnects
~EN PB NWISBN: 3639157249 bzw. 9783639157246, vermutlich in Englisch, VDM Verlag, Taschenbuch, neu.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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On-Chip Inductive Interconnects (2009)
~EN PB NWISBN: 9783639157246 bzw. 3639157249, vermutlich in Englisch, VDM Verlag Dr. Müller, Saarbrücken, Deutschland, Taschenbuch, neu.
Lieferung aus: Deutschland, Next Day, plus shipping.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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