A Novel Methodology for High Speed Board Design - Prevent Crosstalk, Improve Signal & Power Integrity and Reduce EM Emission
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1
A Novel Methodology for High Speed Board Design
EN PB NWISBN: 9783659184369 bzw. 3659184365, in Englisch, LAP Lambert Academic Publishing, Taschenbuch, neu.
Current high-speed designs demand a board designer's extensive knowledge of the issues like transmission line effect, EMI, and crosstalk. Modern PCB design concerned with board material, signal and power stacking, connectors, cables, vias, and trace dimensions. With such designs, the complexity of PCB design increases with the aspects of SI which originate noise and instability. Crosstalk is a major noise that interferes with SI. The noise voltage in the reference or ground of a PCB is often the cause of unwanted radiated emission. Power supply planes attribute to the noise voltage. A Gigabit Ethernet design is developed to analyze various issues on PCB designs like Crosstalk, SI & PI, EMI and Thermal variations. Techniques are investigated to reduce the radiated EM fields, improve power delivery system of the design and eliminate the crosstalk related to routing the high speed signals. SI analysis & thermal analysis help to improve design characteristics. EMI results are within the limits of FCC-CLASS B/ VCCI-CLASS B standards with crosstalk within the limit of 100mV. The design is developed to achieve DFA/DFM/DFT for the manufacturing process of high speed & high dense PCB.
2
A Novel Methodology for High Speed Board Design: Prevent Crosstalk, Improve Signal & Power Integrity and Reduce EM Emission (2012)
EN PB USISBN: 9783659184369 bzw. 3659184365, in Englisch, 112 Seiten, LAP LAMBERT Academic Publishing, Taschenbuch, gebraucht.
Nuevo de: $47.95 (10 Ofrece)
Utilizado de: $68.58 (2 Ofrece)
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Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, super_star_seller.
Current high-speed designs demand a board designer’s extensive knowledge of the issues like transmission line effect, EMI, and crosstalk. Modern PCB design concerned with board material, signal and power stacking, connectors, cables, vias, and trace dimensions. With such designs, the complexity of PCB design increases with the aspects of SI which originate noise and instability. Crosstalk is a major noise that interferes with SI. The noise voltage in the reference or ground of a PCB is often the cause of unwanted radiated emission. Power supply planes attribute to the noise voltage. A Gigabit Ethernet design is developed to analyze various issues on PCB designs like Crosstalk, SI & PI, EMI and Thermal variations. Techniques are investigated to reduce the radiated EM fields, improve power delivery system of the design and eliminate the crosstalk related to routing the high speed signals. SI analysis & thermal analysis help to improve design characteristics. EMI results are within the limits of FCC-CLASS B/ VCCI-CLASS B standards with crosstalk within the limit of 100mV. The design is developed to achieve DFA/DFM/DFT for the manufacturing process of high speed & high dense PCB. Paperback, Etiqueta: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Grupo de producto: Book, Publicado: 2012-07-16, Estudio: LAP LAMBERT Academic Publishing, Rango de ventas: 9486195.
Von Händler/Antiquariat, super_star_seller.
Current high-speed designs demand a board designer’s extensive knowledge of the issues like transmission line effect, EMI, and crosstalk. Modern PCB design concerned with board material, signal and power stacking, connectors, cables, vias, and trace dimensions. With such designs, the complexity of PCB design increases with the aspects of SI which originate noise and instability. Crosstalk is a major noise that interferes with SI. The noise voltage in the reference or ground of a PCB is often the cause of unwanted radiated emission. Power supply planes attribute to the noise voltage. A Gigabit Ethernet design is developed to analyze various issues on PCB designs like Crosstalk, SI & PI, EMI and Thermal variations. Techniques are investigated to reduce the radiated EM fields, improve power delivery system of the design and eliminate the crosstalk related to routing the high speed signals. SI analysis & thermal analysis help to improve design characteristics. EMI results are within the limits of FCC-CLASS B/ VCCI-CLASS B standards with crosstalk within the limit of 100mV. The design is developed to achieve DFA/DFM/DFT for the manufacturing process of high speed & high dense PCB. Paperback, Etiqueta: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Grupo de producto: Book, Publicado: 2012-07-16, Estudio: LAP LAMBERT Academic Publishing, Rango de ventas: 9486195.
3
A Novel Methodology for High Speed Board Design: Prevent Crosstalk, Improve Sign
EN NWISBN: 9783659184369 bzw. 3659184365, in Englisch, neu.
Lieferung aus: Australien, Tipo de entrega: Flat, Entrega: Australien, América, Europa, Asia continental, Neuseeland, Ubicación de oferta: 2114 Australia.
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Von Händler/Antiquariat, ausreseller - AusReseller.
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4
NEW A Novel Methodology for High Speed Board Design by Thiagarajan Kandasamy Pap
EN NWISBN: 9783659184369 bzw. 3659184365, in Englisch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Tipo de entrega: Free, Entrega: En todo el mundo, Ubicación de oferta: 45014 Fairfield,OH,USA, Envío gratuito.
Von Händler/Antiquariat, grandeagleretail.
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5
A Novel Methodology for High Speed Board Design Kandasamy LAP Lam. 9783659184369
DE NWISBN: 9783659184369 bzw. 3659184365, in Deutsch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Tipo de entrega: Free, Entrega: En todo el mundo, Ubicación de oferta: AL60EH Welwyn,United Kingdom, Envío gratuito.
Von Händler/Antiquariat, generalities - scarce and interesting books.
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Von Händler/Antiquariat, generalities - scarce and interesting books.
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