Lead-Free Solder Joint s Size and Configuration Effect: Effect on Mechanical Properties, Microstructure, and Aging Kinetics (Paperback)
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Lead-Free Solder Joint's Size and Configuration Effect: Effect on Mechanical Properties, Microstructure, and Aging Kinetics (2015)
EN PB NWISBN: 9783659778544 bzw. 3659778540, in Englisch, 152 Seiten, LAP LAMBERT Academic Publishing, Taschenbuch, neu.
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Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, Book Depository US.
The properties of Lead-Free solder joints continue to change over a very long time while in service. The assessment of long-term service life of electronics packages invariably misses the effect of solder joint size and configuration, and may thus end up to be seriously misleading. One of the goals of this book is to develop a fundamental understanding of the effects of solder joint size on the mechanical properties of microstructure and aging kinetics. This understanding will help in the assessment of the reliability of Lead-Free solder joints. Paperback, Label: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Produktgruppe: Book, Publiziert: 2015-09-21, Freigegeben: 2015-09-21, Studio: LAP LAMBERT Academic Publishing.
Von Händler/Antiquariat, Book Depository US.
The properties of Lead-Free solder joints continue to change over a very long time while in service. The assessment of long-term service life of electronics packages invariably misses the effect of solder joint size and configuration, and may thus end up to be seriously misleading. One of the goals of this book is to develop a fundamental understanding of the effects of solder joint size on the mechanical properties of microstructure and aging kinetics. This understanding will help in the assessment of the reliability of Lead-Free solder joints. Paperback, Label: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Produktgruppe: Book, Publiziert: 2015-09-21, Freigegeben: 2015-09-21, Studio: LAP LAMBERT Academic Publishing.
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Lead-Free Solder Jointandapos;s Size and Configuration Effect (2015)
DE NWISBN: 9783659778544 bzw. 3659778540, in Deutsch, LAP Lambert Academic Publishing, neu.
Von Händler/Antiquariat, Books2Anywhere [190245], Fairford, GLOS, United Kingdom.
New Book. Delivered from our UK warehouse in 3 to 5 business days.THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
New Book. Delivered from our UK warehouse in 3 to 5 business days.THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Lead-Free Solder Joint s Size and Configuration Effect: Effect on Mechanical Properties, Microstructure, and Aging Kinetics (Paperback) (2015)
DE PB NW RPISBN: 9783659778544 bzw. 3659778540, in Deutsch, LAP Lambert Academic Publishing, Taschenbuch, neu, Nachdruck.
Von Händler/Antiquariat, The Book Depository EURO [60485773], London, United Kingdom.
Language: English Brand New Book ***** Print on Demand *****.
Language: English Brand New Book ***** Print on Demand *****.
4
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Lead-Free Solder Joint's Size and Configuration Effect: Effect on Mechanical Properties, Microstructure, and Aging Kinetics (2015)
DE PB NW RPISBN: 9783659778544 bzw. 3659778540, in Deutsch, LAP LAMBERT Academic Publishing, Taschenbuch, neu, Nachdruck.
Lieferung aus: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, English-Book-Service Mannheim [1048135], Mannheim, Germany.
This item is printed on demand for shipment within 3 working days.
Von Händler/Antiquariat, English-Book-Service Mannheim [1048135], Mannheim, Germany.
This item is printed on demand for shipment within 3 working days.
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Lead-Free Solder Joints Size and Configuration Effect Tashtoush Tariq Paperback
DE PB NWISBN: 9783659778544 bzw. 3659778540, in Deutsch, Taschenbuch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Lieferart: Free, Lieferung: Vereinigtes Königreich Großbritannien und Nordirland, Artikelstandort: UB82RR Uxbridge,United Kingdom, Versandkostenfrei.
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