Practical LED Packaging Technology - 8 Angebote vergleichen
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Practical LED Packaging Technology (2016)
DE PB NW RPISBN: 9783659819957 bzw. 3659819956, in Deutsch, LAP Lambert Academic Publishing Jan 2016, Taschenbuch, neu, Nachdruck.
Lieferung aus: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
This item is printed on demand - Print on Demand Neuware - This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. 276 pp. Englisch.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
This item is printed on demand - Print on Demand Neuware - This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. 276 pp. Englisch.
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Practical LED Packaging Technology
~EN NW ABISBN: 9783659819957 bzw. 3659819956, vermutlich in Englisch, neu, Hörbuch.
Lieferung aus: Österreich, Lieferzeit: 5 Tage, zzgl. Versandkosten.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.
3
Practical LED Packaging Technology
~EN PB NWISBN: 9783659819957 bzw. 3659819956, vermutlich in Englisch, LAP Lambert Academic Publishing, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Practical LED Packaging Technology: This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. Englisch, Taschenbuch.
Practical LED Packaging Technology: This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. Englisch, Taschenbuch.
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Practical LED Packaging Technology (2015)
EN PB USISBN: 9783659819957 bzw. 3659819956, in Englisch, 276 Seiten, LAP LAMBERT Academic Publishing, Taschenbuch, gebraucht.
Neu ab: $49.00 (9 Angebote)
Gebraucht ab: $51.65 (2 Angebote)
Zu den weiteren 11 Angeboten bei Amazon.com
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, Wordery USA.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. Paperback, Label: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Produktgruppe: Book, Publiziert: 2015-12-21, Freigegeben: 2015-12-21, Studio: LAP LAMBERT Academic Publishing.
Von Händler/Antiquariat, Wordery USA.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. Paperback, Label: LAP LAMBERT Academic Publishing, LAP LAMBERT Academic Publishing, Produktgruppe: Book, Publiziert: 2015-12-21, Freigegeben: 2015-12-21, Studio: LAP LAMBERT Academic Publishing.
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Practical Led Packaging Technology by Kim N y and Chuluunbaatar Z (2015,.
EN NWISBN: 9783659819957 bzw. 3659819956, in Englisch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Lieferart: Free, Lieferung: Vereinigte Staaten von Amerika, Artikelstandort: USA, Versandkostenfrei.
Von Händler/Antiquariat, barnesandnobleinc - Barnes and Noble Store.
Sold directly by Barnes & Noble, Festpreisangebot.
Von Händler/Antiquariat, barnesandnobleinc - Barnes and Noble Store.
Sold directly by Barnes & Noble, Festpreisangebot.
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Practical LED Packaging Technology | N. Y. Ki . 9783659819957 | dpd Versand
DE NWISBN: 9783659819957 bzw. 3659819956, in Deutsch, neu.
Lieferung aus: Deutschland, Lieferart: Flat, Lieferung: Weltweit, Artikelstandort: 37574 Deutschland.
Von Händler/Antiquariat, aha-buch - AHA-BUCH.
Festpreisangebot.
Von Händler/Antiquariat, aha-buch - AHA-BUCH.
Festpreisangebot.
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