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100%: M. Alexe, U. G÷sele, Herausgeber: Marin Alexe, Herausgeber: Ulrich Gösele: Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (ISBN: 9783662108277) 2013, 2004. Ausgabe, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
31%: Sous la direction de: Marin Alexe, Sous la direction de: Ulrich Gosele: Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (ISBN: 9783642059155) 2011, in Englisch, Taschenbuch.Nur diese Ausgabe anzeigen…
Wafer Bonding: Applications and Technology (Springer Series in Materials Science)
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1
Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (2011)
EN PB NW RPISBN: 9783642059155 bzw. 3642059155, in Englisch, 504 Seiten, Springer, Taschenbuch, neu, Nachdruck.
Ново от: $277.69 (11 Оферти)
Използван от: $289.87 (5 Оферти)
Покажи още 16 Оферти в Amazon.com
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 24 hours.
Von Händler/Antiquariat, Amazon.com.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Paperback, Издание: Softcover reprint of the original 1st ed. 2004, Етикет: Springer, Springer, Продуктова група: Book, Публикувани: 2011-09-30, Студио: Springer, Продажбата ранг: 11924741.
Von Händler/Antiquariat, Amazon.com.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Paperback, Издание: Softcover reprint of the original 1st ed. 2004, Етикет: Springer, Springer, Продуктова група: Book, Публикувани: 2011-09-30, Студио: Springer, Продажбата ранг: 11924741.
2
Wafer Bonding
~EN NW EB DLISBN: 9783662108277 bzw. 3662108275, vermutlich in Englisch, Springer Shop, neu, E-Book, elektronischer Download.
Lieferung aus: Japan, Lagernd, zzgl. Versandkosten.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. eBook.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. eBook.
3
Wafer Bonding - Applications and Technology
~EN NW EB DLISBN: 9783662108277 bzw. 3662108275, vermutlich in Englisch, Springer Berlin Heidelberg, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, Versandkostenfrei.
Wafer Bonding: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Englisch, Ebook.
Wafer Bonding: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Englisch, Ebook.
4
Wafer Bonding
EN NW EB DLISBN: 9783662108277 bzw. 3662108275, in Englisch, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
5
Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (2013)
EN NW EB DLISBN: 9783662108277 bzw. 3662108275, in Englisch, 499 Seiten, 2004. Ausgabe, Springer, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, E-Book zum Download, Versandkostenfrei.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Kindle Edition, Ausgabe: 2004, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2013-03-09, Freigegeben: 2013-03-09, Studio: Springer.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Kindle Edition, Ausgabe: 2004, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2013-03-09, Freigegeben: 2013-03-09, Studio: Springer.
6
Wafer Bonding
EN PB NWISBN: 9783642059155 bzw. 3642059155, in Englisch, Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Taschenbuch, neu.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
8
Wafer Bonding: Applications and Technology (Springer Series in Materials Science
DE NWISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, neu.
Lieferung aus: Australien, Тип доставка: Flat, Доставка: Australien, Америка, Европа, Континентална Азия, Neuseeland, Оферта местоположение: 2114 Australia.
Von Händler/Antiquariat, ausreseller - AusReseller.
Фиксирана цена.
Von Händler/Antiquariat, ausreseller - AusReseller.
Фиксирана цена.
9
NEW Wafer Bonding BOOK (Paperback) Free P&H
DE PB NWISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, Taschenbuch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Тип доставка: Free, Доставка: Европа, Оферта местоположение: USA, Безплатна доставка.
Von Händler/Antiquariat, grey_elk_books_au_and_uk - Grey Elk Books.
Фиксирана цена.
Von Händler/Antiquariat, grey_elk_books_au_and_uk - Grey Elk Books.
Фиксирана цена.
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